Title:
THERMOSETTING RESIN COMPOSITION, AND PREPREG, FILM WITH RESIN, LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE PREPARED THEREWITH
Document Type and Number:
Japanese Patent JP2017190460
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition that satisfactorily exhibits a low curing shrinkage, a low thermal expansion, excellent dielectric properties, and a high elastic modulus, and a prepreg, a film with resin, a laminate, a printed wiring board and a semiconductor package prepared therewith.SOLUTION: A thermosetting resin composition contains an aromatic azomethine compound (A) having at least one aldehyde group in one molecule, a siloxane compound (B) having a primary amino group, and a maleimide compound (C) having an N-substituted maleimide group. There are also provided a prepreg, a film with resin, a laminate, a printed wiring board and a semiconductor package prepared therewith.SELECTED DRAWING: None
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Inventors:
KOTAKE TOMOHIKO
NAGAI SHUNSUKE
HASHIMOTO SHINTARO
ABE SHINICHIRO
MIYATAKE MASATO
TAKANEZAWA SHIN
MURAI HIKARI
NAGAI SHUNSUKE
HASHIMOTO SHINTARO
ABE SHINICHIRO
MIYATAKE MASATO
TAKANEZAWA SHIN
MURAI HIKARI
Application Number:
JP2017126474A
Publication Date:
October 19, 2017
Filing Date:
June 28, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08G73/00; C08G12/40; C08J5/24; C08K3/00; C08L79/00; C08L101/02; H05K1/03
Domestic Patent References:
| JP2005148112A | 2005-06-09 | |||
| JP2015086253A | 2015-05-07 | |||
| JP2012001486A | 2012-01-05 |
Foreign References:
| WO2012099132A1 | 2012-07-26 |
Attorney, Agent or Firm:
Tamotsu Otani
Kenichi Hirasawa
Kosuke Sawayama
Kenichi Hirasawa
Kosuke Sawayama