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Title:
THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
Document Type and Number:
Japanese Patent JP2017214524
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which has high glass transition temperature and low thermal expansion, is excellent in dielectric characteristics, solder heat resistance and storage stability, and does not need to set a press temperature at the time of prepreg lamination at 220°C or higher, and to provide a prepreg, a laminate, a printed wiring board and a semiconductor package using the thermosetting resin composition.SOLUTION: A thermosetting resin composition contains an imidazole compound (A) represented by general formula (A1) and a modified maleimide resin (B) being a reactant of a maleimide compound (b-1) having at least two N-substituted maleimide groups in one molecule and an amine compound (b-2) having at least two primary amino groups in one molecule, and contains no epoxy resin or contains an epoxy resin.SELECTED DRAWING: None

Inventors:
TONAI SHUNSUKE
DANSEIGEN KAZUTOSHI
SHIMADA TOMOKAZU
MORITA KOJI
OHASHI KENICHI
Application Number:
JP2016110865A
Publication Date:
December 07, 2017
Filing Date:
June 02, 2016
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L39/04; C08K5/3472; C08L63/00; C08L83/04
Domestic Patent References:
JPH07179756A1995-07-18
JPH06136266A1994-05-17
JPH05247345A1993-09-24
JPS6445463A1989-02-17
JPH03264347A1991-11-25
JPS62297355A1987-12-24
JPH02222419A1990-09-05
Foreign References:
WO2012099133A12012-07-26
Attorney, Agent or Firm:
大谷 保
平澤 賢一
澤山 要介