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Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH04170469
Kind Code:
A
Abstract:
PURPOSE:To obtain the title composition which can give a cured product excellent in chemical properties, physical properties and weathering resistance by mixing a compound having a plurality of specified vinyl (thio)ether groups with a compound having a plurality of acetoacetyl groups in the molecule. CONSTITUTION:A resin composition comprising a compound (A) having at least too vinyl ether groups or vinyl thioether groups of the formula in the molecule and a compound (B) having at least two acetoacetyl groups in the molecule. In the formula, R1 to R5 are each II or a 1-18C organic group; R1 and R4, R1 and R5, R2 and R4 or R2 and R5 may be combined with each other to form a heterocyclic ring having Y as a heteroatom, and Y is 0 or S. Components (A) and (B) are desirably used in such a ratio that the equivalent ratio of the vinyl ether or vinyl thioether groups of component (A) to the acetoacetyl groups of component (B) is 0.2:1 to 1.0:0.2.

Inventors:
SHIBAMOTO KENJI
SHIBAFUJI KISHIO
ISHIDOYA MASAHIRO
Application Number:
JP29853290A
Publication Date:
June 18, 1992
Filing Date:
November 02, 1990
Export Citation:
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Assignee:
NIPPON OILS & FATS CO LTD
International Classes:
C08K5/06; C08F34/00; C08F34/02; C08F290/00; C08F299/00; C08G18/62; C08K5/07; C08K5/37; C08L101/00; (IPC1-7): C08F34/02; C08F299/00; C08G18/62; C08K5/06; C08K5/07; C08K5/37; C08L101/00



 
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