Title:
THERMOSETTING RESIN MOLDING METHOD
Document Type and Number:
Japanese Patent JP2018144457
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting resin molding method capable of obtaining a molded article having a thick portion with high dimensional accuracy.SOLUTION: The thermosetting resin molding method comprises the steps of: filling a thermosetting resin material into a cavity of a molding die having permeability to a specific electromagnetic wave selected from a wavelength region of 0.78-2 μm and 0.01-100 m; and irradiating the molding die with the specific electromagnetic wave.SELECTED DRAWING: Figure 1
Inventors:
MIZUNO YOSHIHISA
KURIHARA FUMIO
KAGAWA SHINGO
KURIHARA FUMIO
KAGAWA SHINGO
Application Number:
JP2017044757A
Publication Date:
September 20, 2018
Filing Date:
March 09, 2017
Export Citation:
Assignee:
JSR CORP
International Classes:
B29C39/02; B29C33/38; B29C39/24; B29C39/26
Domestic Patent References:
| JPH11300766A | 1999-11-02 | |||
| JP2016222873A | 2016-12-28 | |||
| JP2010269541A | 2010-12-02 | |||
| JPH01304914A | 1989-12-08 | |||
| JPS5421461A | 1979-02-17 |
Foreign References:
| WO2016167323A1 | 2016-10-20 | |||
| WO2011073433A1 | 2011-06-23 | |||
| WO2012173053A1 | 2012-12-20 | |||
| WO2015025166A1 | 2015-02-26 | |||
| CN105415715A | 2016-03-23 | |||
| US20130285292A1 | 2013-10-31 |
Attorney, Agent or Firm:
Masahiko Oi