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Patent Searching and Data


Title:
THIN FILM INTEGRATED CIRCUIT SUBSTRATE
Document Type and Number:
Japanese Patent JPS5913392
Kind Code:
A
Inventors:
HARADA KEIJI
Application Number:
JP12313082A
Publication Date:
January 24, 1984
Filing Date:
July 15, 1982
Export Citation:
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Assignee:
NIPPON ELECTRIC CO
International Classes:
H05K1/02; H05K3/00; (IPC1-7): H05K1/02; H05K3/00