PURPOSE: To manufacture a module board of a thin film unit laminated type for a large-scale computer in mass production and to obtain a preferable connecting device by opposing upper and lower thin film units made of thin film wiring parts, optically aligning them, securing to each other, heating and bringing them into pressure contact with each other.
CONSTITUTION: Alignment marks or thin film wiring patterns on opposed upper and lower thin film units 1, 1' are read by a plurality of CCD cameras 4, 4', 5, 5', position-recognized, and misalignment are corrected. Then, the units 1, 1' and sample holders 2, 2' are mounted and secured by vacuum sucking forces. Then, they are connected through the holders 2, 2' by pressure, heated and connected by pressure. Thus, an apparatus for manufacturing a high density mounting module board of a thin film unit laminated type for a large-scale computer can be obtained.
MIURA OSAMU
MIYAZAKI KUNIO
SHIODA KATSUHIKO
OGOSHI YUKIO
HIRASAWA MASANARI
