Title:
【発明の名称】合板の製法
Document Type and Number:
Japanese Patent JP2656227
Kind Code:
B2
Abstract:
It has now been found that when there is a partial or complete replacement of the sodium hydroxide that is used to make a sodium phenolate resole resin by a molar equivalent of potassium hydroxide, a far faster curing resin is obtained. Such potassium-modified phenoli resins exhibit significant improvement in cure speed without loss of flowability. To the contrary, these resins act as though they were lower molecular weight condensation products. Reduced application rates are possible. The combination of faster cure and lower application rates has allowed such resins to be used as effective adhesives for plywood, for example, with veneer and interior plies having a higher moisture content than was previously possible. Generally, resins according to the invention may contain from about 1% to about 15%, and preferably from about 1% to about 7% by weight, of potassium hydroxide, or more.
Inventors:
NITSUKU KENTO DEIJII
DEIRU REZURII RIIPAA
DEIRU REZURII RIIPAA
Application Number:
JP16224695A
Publication Date:
September 24, 1997
Filing Date:
June 28, 1995
Export Citation:
Assignee:
BOODEN CHEM INC
International Classes:
B27D1/04; B27N3/02; B27N3/14; B32B21/02; B32B27/04; C08G8/10; C08G14/08; C08L61/04; C08L61/06; C09J161/06; (IPC1-7): B27D1/04; B32B21/02; C08L61/06
Attorney, Agent or Firm:
Chika Takagi (2 outside)