Title:
CONSTITUTION OF ELECTRONIC PART
Document Type and Number:
Japanese Patent JPS6028250
Kind Code:
A
Abstract:
PURPOSE:To uniformize the flow of solder, and to improve adhesive properties between a wiring pattern on a substrate and a solder bump by changing the shape of the bump in response to the width of the pattern when the solder bump is formed to an LSI chip and the wiring pattern is bonded to the bump. CONSTITUTION:When bonding patterns 23 having large line width and bonding patterns 23' having small line width mutually running parallel are formed to an LSI chip 21 and solder bumps are shaped to the predetermined surfaces of these patterns, the following process is executed. That is, the large solder bumps 22 are formed on the patterns 23 having large line width, and the small solder bumps 22' are shaped on the patterns 23' having small line width. Accordingly, the width of the bonding patterns and the size of the bumps are kept in prescribed relationship, and the quality of an electronic part is stabilized.
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Inventors:
YAMASHITA TOORU
Application Number:
JP13823483A
Publication Date:
February 13, 1985
Filing Date:
July 27, 1983
Export Citation:
Assignee:
SHARP KK
International Classes:
H01L21/60; H05K3/34; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Sugiyama Takeshi