Title:
【発明の名称】セラミック積層電子部品の製造方法
Document Type and Number:
Japanese Patent JP2869901
Kind Code:
B2
Abstract:
A method of fabricating a ceramic laminated electronic component including the steps of preparing a plurality of ceramic green sheets each having electrode pastes in a plurality of regions and having positioning marks printed in positions having a constant positional relationship to the electrode pastes, removing wrinkles in each of the ceramic green sheets to flatten the ceramic green sheet on a suction plate, and transferring the flattened ceramic green sheet to a laminating stage by a suction chuck, laminating the ceramic green sheet on the laminating stage on the basis of the above positioning marks, and preliminarily fixing the ceramic green sheets to each other in the case of the lamination in obtaining a mother ceramic laminated body for the ceramic laminated electronic component.
Inventors:
KAWABATA SHOICHI
WAKATSUKI HIROMICHI
SAKAI NORIO
OKADA KEIICHI
WAKATSUKI HIROMICHI
SAKAI NORIO
OKADA KEIICHI
Application Number:
JP33927790A
Publication Date:
March 10, 1999
Filing Date:
November 30, 1990
Export Citation:
Assignee:
MURATA SEISAKUSHO KK
International Classes:
H01G4/12; B28B3/02; B28B11/00; B28B13/04; H01G4/30; H01G4/40; H05K3/46; H05K1/02; H05K1/03; H05K1/09; (IPC1-7): H01G4/12
Domestic Patent References:
| JP61219125A | ||||
| JP2166793A | ||||
| JP2162710A | ||||
| JP6465817A |
Attorney, Agent or Firm:
Miya Saki Main tax