Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
TO PACKAGE WITH GROUND CONNECTION
Document Type and Number:
Japanese Patent JP2020036008
Kind Code:
A
Abstract:
To provide a TO package (1).SOLUTION: A TO package includes a header (2). The header has an upper surface (21) which, once a cap (3) has been attached, defines an inner surface of the then hermetically sealed TO package, a lower surface (14), and a mounting area (30) for an optoelectronic element. The header has signal pins (7, 7a, 7b) used to connect the optoelectronic component, the signal pin being disposed in a feedthrough (9). In such a case, a printed circuit board (12) is attached on the signal pins substantially coaxially thereto, and the printed circuit board is mechanically coupled and electrically connected to the header by a metal block (13) arranged adjacent to the feedthrough to provide grounding. The header further includes the signal pins that have respective enlarged portions (19, 19a, 19b), and the enlarged portions lie in the same plane as a base of the header or protrude into the package.SELECTED DRAWING: Figure 1

Inventors:
ROBERT HETTLER
ARTIT AOWUDOMSUK
KENNETH TAN
KARSTEN DROEGEMUELLER
Application Number:
JP2019153682A
Publication Date:
March 05, 2020
Filing Date:
August 26, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SCHOTT AG
International Classes:
H01S5/022
Domestic Patent References:
JP2004356334A2004-12-16
JP2005142238A2005-06-02
JP2014138190A2014-07-28
JPH11238916A1999-08-31
JPH0629451A1994-02-04
JPH05218279A1993-08-27
JP2012174917A2012-09-10
JP2007088233A2007-04-05
JP2006216839A2006-08-17
JP2006506807A2006-02-23
JP2005150226A2005-06-09
JP2004311923A2004-11-04
JP2004214651A2004-07-29
JP2004207259A2004-07-22
Foreign References:
US20120207437A12012-08-16
US7837085B12010-11-23
US20060202321A12006-09-14
US20050018994A12005-01-27
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima