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Title:
TRANSFER METHOD FOR SEMICONDUCTOR WAFER OF SEMICONDUCTOR MANUFACTURE DEVICE
Document Type and Number:
Japanese Patent JP3891636
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To reduce the damage of a semiconductor wafer at the time of thermal treatment and to improve the quality of the semiconductor wafer.
SOLUTION: The device is provided with a reaction container where the film forming treatment of the semiconductor wafer 1 is executed, a lamp heating the semiconductor wafer 1 at the time of film forming treatment, a susceptor 4 which is installed in the reaction container and supports the semiconductor wafer 1 at the time of film forming treatment, a transportation blade 5 guiding the carry-in/out of the semiconductor wafer 1 into/from the reaction container, lift pins 6 which repeat/support the semiconductor wafer 1 at the time of transferring the semiconductor wafer 1 to the susceptor 4 from the transportation blade 5 and a control part controlling the transfer procedure of the semiconductor wafer 1 from the lift pins 6 to the susceptor 4. At the time of transferring the susceptor 4 from the transportation blade 5 on the susceptor 4 through the lift pins 6, the warp of the semiconductor wafer 1 which is carried into the reaction container, is heated and warped is restored on the lift pins 6 and the wafer is transferred to the susceptor 4.


Inventors:
Kenji Kawakami
Application Number:
JP10458897A
Publication Date:
March 14, 2007
Filing Date:
April 22, 1997
Export Citation:
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Assignee:
Renesas Technology Corp.
International Classes:
C30B25/12; H01L21/205; H01L21/20; H01L21/26; H01L21/324; (IPC1-7): H01L21/26; C30B25/12; H01L21/20; H01L21/205; H01L21/324
Domestic Patent References:
JP6130237U
JP6381933A
JP1050684A
JP10173023A
Attorney, Agent or Firm:
Yamato Tsutsui