Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
TRANSFER MOLDING DEVICE
Document Type and Number:
Japanese Patent JP2014069540
Kind Code:
A
Abstract:

To provide a transfer molding device capable of easily releasing air from between a resin plate and a stamper.

There is provided a transfer molding device which comprises: a bucket 80 for storing a resin plate J and a stamper 823 having an uneven pattern one over the other; and a vacuum processing part 20 for sucking air inside the bucket 80 and presses the stamper 823 to the resin plate J to transfer-mold the uneven patter on the resin plate J, wherein the stamper 823 comprises: a contact surface 823a in contact with the resin plate J; and a non-contact surface 823b which is formed at a position lower than the contact surface 823a at the periphery of the contact surface 823a and is not in contact with the resin plate J, and the resin plate J is configured to have an outer shape larger than the contact surface 823a.


Inventors:
NANBA YOSHINORI
TACHI SEIYA
Application Number:
JP2012219815A
Publication Date:
April 21, 2014
Filing Date:
October 01, 2012
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
IDEMITSU UNITECH CO LTD
International Classes:
B29C59/02; B29C43/02; G11B5/84; G11B7/26
Attorney, Agent or Firm:
Kihei Watanabe
Okano Isao
Tetsuya Imai



 
Previous Patent: IMAGE FORMING APPARATUS

Next Patent: TRANSFER MOLDING APPARATUS