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Title:
TRIMMING OF SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JPH04129263
Kind Code:
A
Abstract:

PURPOSE: To make it possible to cut another resistor while one resistor is cooled after the resistor is trimmed by a method wherein identical trimming resistors are arranged on the both ends of a thick film circuit board, with the resistors being divided into two parts and alternately undergo laser trimming.

CONSTITUTION: At first, a hybrid IC is set to operation, and one thick film resistor 3a is cut only a little by a laser while the voltage value on the position to be adjusted is monitored, thereby increasing the resistance value of the thick film resistor 3a and changing the voltage value at the position to be adjusted. A thick film circuit board 1 is heated by the laser in this instance, and then, another thick film resistor 3a is burned off only a little bit by a laser while the heat near the resistor 3a is radiated. By alternately repeating the operation stated above, the trimming will be terminated when the voltage value on the position to be adjusted reaches the target value.


Inventors:
TOMIOKA MASANORI
Application Number:
JP1990000251095
Publication Date:
April 30, 1992
Filing Date:
September 19, 1990
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B23K26/361; B23K26/351; H01L27/01; (IPC1-7): B23K26/00; H01L27/01



 
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