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Patent Searching and Data


Title:
TWO-LAYER MOLDING AND ITS MOLDING METHOD
Document Type and Number:
Japanese Patent JP2001287244
Kind Code:
A
Abstract:

To provide a two-layer molding in which a thin surface layer which forms a design surface and is excellent in appearance and a back layer formed from a recycled material are molded integrally.

With the use of a mold for injection molding in which a design surface side inner surface is coated with an insulating layer at least 10 μm in thickness made of a heat resistant resin 0.01 cal/cm.sec.°C or below in heat conductivity, after a back layer resin is injected into the mold, the mold is opened slightly, and a surface resin is injected between the mold and the back layer resin for molding.


Inventors:
WATANABE MASAMI
TAKANO FUMIYOSHI
Application Number:
JP2000102919A
Publication Date:
October 16, 2001
Filing Date:
April 05, 2000
Export Citation:
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Assignee:
ASAHI KASEI CORP
International Classes:
B29C45/37; B29C33/38; B29C45/16; (IPC1-7): B29C45/37; B29C33/38; B29C45/16
Attorney, Agent or Firm:
Keisuke Watanabe (1 person outside)