ULTRASONIC CLEANING APPARATUS AND ULTRASONIC CLEANING METHOD

Japanese Patent JP2013021160

A

To provide an ultrasonic cleaning apparatus and an ultrasonic cleaning method capable of suppressing occurrence of damage on a substrate to be cleaned, and capable of cleaning a high precision substrate used in the electronics industry with high cleanliness.

While holding an object to be cleaned so as to be located under the level of cleaning liquid in the vicinity thereof on the outside of a region (ultrasonic wave irradiation region) extending from the vibration surface of an ultrasonic vibrator in a perpendicular direction to the liquid level, a surface-tension wave is excited on the surface of the cleaning liquid by ultrasonic waves. Occurrence of damage on the substrate to be cleaned is suppressed by exfoliating particulate contamination of the object to be cleaned by means of the sound pressure of the surface-tension wave, without irradiating the object to be cleaned directly with the ultrasonic waves.

JP5309230	Simultaneous double-sided material removal processing method for insertion carriers and semiconductor wafers
JP5654753	Determining the end point of polishing using the spectrum

SUZUKI KAZUNARI

JP2011153803A

January 31, 2013

July 12, 2011

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KAIJO KK

H01L21/304; B08B3/12

JP2000173978A	2000-06-23
JP2000053047A	2000-02-22
JPH1140645A	1999-02-12

Masaharu Hagiri
Taku Sasakawa
Tomoaki Ono
Keiyo Nakamura

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