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Title:
ULTRASONIC PROBE, MANUFACTURING METHOD FOR ULTRASONIC PROBE, AND ULTRASONIC DIAGNOSING APPARATUS
Document Type and Number:
Japanese Patent JP2007282743
Kind Code:
A
Abstract:

To provide an ultrasonic probe which sufficiently attenuates an ultrasonic wave by a back face member, and at the same time, has high heat radiating characteristics.

A plurality of ultrasonic oscillators 2 are arranged into one row in the scanning direction with an interval of a groove section 7. Directly under each ultrasonic oscillator 2, the first back face member 5 of a high damping medium is arranged. The second back face member 6 of a high thermal conductor has a protruding section 6a and a recess section 6b. The first back face member 5 is arranged in the recess section 6b, and the protruding section 6a of the second back face member 6 is provided between individual first back face members 5. Thus, directly under each ultrasonic oscillator 2, the first back face member 5 of the high damping medium is set, and directly under the space (groove section 7) of each ultrasonic oscillator 2, the second back face member 6 of the high thermal conductive body is set. As a result, the ultrasonic wave is sufficiently attenuated by the first back face member 5, and this ultrasonic probe enables the heat caused by the vibration of the ultrasonic oscillators 2 to be efficiently emitted by the second back face member 6.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
OGAWA TAKASHI
YOMO HIROYUKI
Application Number:
JP2006111641A
Publication Date:
November 01, 2007
Filing Date:
April 14, 2006
Export Citation:
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Assignee:
TOSHIBA CORP
TOSHIBA MEDICAL SYS CORP
International Classes:
A61B8/00
Attorney, Agent or Firm:
Masayoshi Misawa



 
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