Title:
ULTRASONIC WIRE BONDING METHOD AND APPARATUS THEREFOR
Document Type and Number:
Japanese Patent JPH1131723
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To obtain desired bonding strength in real time, regardless of the surface shape of a bonding part. SOLUTION: This device 1 is constituted of a frame 2, work setting device (X-Y stand 3a, rotary stand 3c, shaft shift mechanism 3c, shaft 3d each), friction coefficient measuring device 6, a bonding controller (bonding tool controlling part 7a, bonding wire controlling part 7b each), and a pattern recognition optical device 8 or the like. In this case, a work 5 is set on the work stand 4, and the friction coefficient of each bonding part of the work 5 is measured by the friction coefficient measuring device 6 prior to bonding. Then, bonding is operated by an ultrasonic output which is decided based on this friction coefficient.
Inventors:
SASAOKA HIROSHI
Application Number:
JP18509997A
Publication Date:
February 02, 1999
Filing Date:
July 10, 1997
Export Citation:
Assignee:
TOYOTA MOTOR CORP
International Classes:
H01L21/60; H01L21/607; (IPC1-7): H01L21/607; H01L21/60
Attorney, Agent or Firm:
Hironobu Onda
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