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Title:
VIBRATION DEVICE, MANUFACTURING METHOD OF VIBRATION DEVICE, AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2012182765
Kind Code:
A
Abstract:

To provide a vibration device and an electronic apparatus which are small and reduce the cost, and to provide a manufacturing method of the vibration device.

A sensor device 1 has: a substrate 2 including multiple metal pillars having first surfaces 2a and second surfaces 2b that face the opposite side of the first surfaces 2a and provided so as to be electrically independent of each other and an insulation body 33 filling spaces between the first surfaces 2a of the multiple metal pillars and surfaces that are different from the second surfaces 2b and integrally fixing the multiple metal pillars; an IC chip having an electrode pad 11 on an active surface 10a and fixed to a first metal pillar 3; a sensor element 20 having a support part 21 and a vibration part 22 and joined to the active surface 10a of the IC chip 10 at the support part 21 to be supported by the IC chip 10; bonding wires 99 electrically connecting the electrode pad 11 with second metal pillars 4A, 4B, 4A', 4B'; and a lid 9 provided so as to cover the IC chip 10 and the sensor element 20.


Inventors:
OTSUKI TETSUYA
Application Number:
JP2011045999A
Publication Date:
September 20, 2012
Filing Date:
March 03, 2011
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
H03H9/02; G01C19/5628; H01L23/12; H01L25/00; H03B5/32; H03H3/02
Domestic Patent References:
JPH0738334A1995-02-07
Foreign References:
WO2010035499A12010-04-01
Attorney, Agent or Firm:
上柳 雅誉
宮坂 一彦
須澤 修