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Patent Searching and Data


Title:
VIBRATION FUSION BONDED HOLLOW MOLDING MADE OF POLYAMIDE RESIN
Document Type and Number:
Japanese Patent JPH08281827
Kind Code:
A
Abstract:

PURPOSE: To obtain a vibration fusion bonded hollow molding made of polyamide resin which has small warpage, no decrease in fusion bonding strength and excellent external appearance.

CONSTITUTION: The vibration fusion bonded hollow molding made of polyamide resin comprises (a) 0 to 89wt.% of polyamide resin having 2.5 to 4.0 of relative viscosity and 50mJ/mg or more of melting enthalpy, (b) 1 to 90wt.% of polyamide resin having 1.5 to 4.0 of relative viscosity and 50mJ/mg or less of melting enthalpy, (c) 10 to 60wt.% of glass fiber and (d) 0 to 30wt.% of platelike filler. A plurality of hollow products 4 molded by using the polyamide resin composition containing 40 to 90wt.% of the sum of the resins (a) and (b) and 10 to 60wt.% of the sum of the fiber (c) and the filler (d) is vibration fusion bonded.


Inventors:
URABE HIROSHI
OYAMA HAJIME
HITOMI TATSUYA
Application Number:
JP10911795A
Publication Date:
October 29, 1996
Filing Date:
April 11, 1995
Export Citation:
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Assignee:
MITSUBISHI ENG PLAST KK
International Classes:
B29C65/06; B29D22/00; C08K7/14; C08L77/00; B29K77/00; B29K105/06; B29L22/00; (IPC1-7): B29D22/00; B29C65/06; C08K7/14; C08L77/00
Attorney, Agent or Firm:
Hasegawa Hajime (2 outside)