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Title:
VIBRATION-PROOF MOUNT ASSEMBLY
Document Type and Number:
Japanese Patent JPS62202545
Kind Code:
A
Abstract:
An assembly (Figure l) including an electronic device (3) and package body (9) mounted upon a block (l5). Bending effects are minimised by locating the package body (9) and block (l5) upon a suspension system (l7,l9) that is located symmetrically with respect to the body centre and that lies within the body periphery. Point, bar hollow rectangle or ring suspension may be adopted. Where ring suspension is used, the ring radius can be chosen to minimise bending effect in the plane of the device (3). An array of devices can be substituted for the single device mentioned. The device (3) is preferably located at or near the neutral bending plane of the assembly. To this end the lid (2l) of the package (9) may be of significantly large mass.

Inventors:
RONARUDO UIRIAMU BITSUKUNERU
NIKORASU MARUTEIN SHIYOOROTSUK
Application Number:
JP29648386A
Publication Date:
September 07, 1987
Filing Date:
December 12, 1986
Export Citation:
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Assignee:
PLESSEY OVERSEAS
International Classes:
F16F15/02; G01J5/04; G12B5/00; G12B17/08; (IPC1-7): F16F15/02; H01L23/32



 
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