Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
VISUAL INSPECTION METHOD FOR ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JPH085572
Kind Code:
A
Abstract:

PURPOSE: To obtain visual inspection method for electronic device by which a solder bridge between the electrodes of an electronic device mounted on a board can be inspected optically and automatically.

CONSTITUTION: A two electrode rectangular electronic device 73 is observed by means of a camera and scanning lines 79, 79a, 79b are set between the electrodes in order to inspect a solder 78 present on the scanning line 79, 79a or 79b. If a solder 78 is found, a decision is made that a solder bridge is present thus deciding that the soldered state is not acceptable.


Inventors:
TOKURA NOBUSHI
Application Number:
JP1995000127837
Publication Date:
January 12, 1996
Filing Date:
May 26, 1995
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
G01N21/88; G01M11/00; G01N21/956; G06T1/00; G06T7/00; (IPC1-7): G01N21/88; G01M11/00; G06T7/00
Domestic Patent References:
JPS61293658A1986-12-24
JPS6176940A1986-04-19
JPS62133341A1987-06-16
JPS61290311A1986-12-20
Attorney, Agent or Firm:
Tomoyuki Takimoto (1 person outside)