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Patent Searching and Data


Title:
WAFER FITTING BASE
Document Type and Number:
Japanese Patent JPH08264497
Kind Code:
A
Abstract:

PURPOSE: To improve a net working rate of an apparatus by easily replacing a rear surface pad of a wafer fitting base and controlling a replacement frequency in a wafer grinding apparatus.

CONSTITUTION: A rear surface pad attached to a wafer fitting base is divided into a center rear surface pad 4 in the region where a hole 3 for pressurizing and absorption during mounting or removal of the wafer on the stage and a peripheral rear surface pad 5 which will be deteriorated fast. Thereby, on the occasion of deterioration of the rear surface pad, it can be replaced easily only with replace of the peripheral rear surface pad 5. Moreover, an availability factor of the wafer grinding apparatus which can reduce the replacement frequency can be improved by forming the peripheral rear surface pad 5 with a material having a higher elasticity recovery rate than that of the center rear surface pad 4.


Inventors:
MORITA TOMOTAKE
Application Number:
JP1995000064064
Publication Date:
October 11, 1996
Filing Date:
March 23, 1995
Export Citation:
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Assignee:
NEC CORP
International Classes:
B24B37/04; B24B37/30; H01L21/304; (IPC1-7): H01L21/304; B24B37/04
Attorney, Agent or Firm:
京本 直樹 (外2名)