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Title:
WAFER HEATING UNIT
Document Type and Number:
Japanese Patent JP2005294606
Kind Code:
A
Abstract:

To restrain a temperature distribution mainly in the circumferential direction appearing on a wafer heated surface, in a wafer heating unit.

A wafer heating unit 16 comprises a plate-like body 13 with a wafer heated surface 13a and a rear 13b, and a heater 6 installed at the rear 13b of the plate-like body 13. This plate-like body 13 can rotate relatively with respect to the heater 6. It is recommended that the plate-like body 13 can rotate with the central shaft D of the heater 6 as a center, and a clearance 14 is formed between the plate-like body 13 and the heater 6.


Inventors:
GOTO YOSHINOBU
KIKU TAIJI
Application Number:
JP2004000108667
Publication Date:
October 20, 2005
Filing Date:
April 01, 2004
Export Citation:
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Assignee:
NGK INSULATORS LTD
International Classes:
H05B3/18; H01L21/02; H01L21/205; H01L21/324; H01L21/68; H01L21/683; H05B3/74; (IPC1-7): H01L21/02; H01L21/205; H01L21/324; H01L21/68; H05B3/18; H05B3/74
Domestic Patent References:
JP2003133233A2003-05-09
JP2000311769A2000-11-07
JP2004052098A2004-02-19
JPS5814945A1983-01-28
JPH07307300A1995-11-21
JP2003133195A2003-05-09
JP2003045765A2003-02-14
JP2004006242A2004-01-08
Attorney, Agent or Firm:
細田 益稔
青木 純雄