WAFER HOLDER FOR SEMICONDUCTOR MANUFACTURING APPARATUS

Title:

WAFER HOLDER FOR SEMICONDUCTOR MANUFACTURING APPARATUS

Document Type and Number:

Japanese Patent JP2013089850

Kind Code:

A

Abstract:

To provide a wafer holder which makes damage due to heat stress less likely to occur in a wafer holder and is excellent in heat uniformity.

A wafer holder for a semiconductor manufacturing apparatus is composed of: a substrate 1 having an embedded heating element 2 and formed by a material composed mainly of aluminum nitride; and a cylindrical support medium 4 mechanically coupling to the substrate 1 and supporting the substrate 1. In the wafer holder for the semiconductor manufacturing apparatus, a cylindrical body 12 housing a temperature measuring element 11 for measuring a temperature of the substrate 1 is provided in the support medium 4. The ambient atmosphere exists in the cylindrical body 12 and is isolated from the atmosphere in the support medium 4.

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Inventors:

KIMURA KOICHI
SHIMAO DAISUKE
NATSUHARA MASUHIRO
MIKUMO AKIRA
NAKADA HIROHIKO

Application Number:

JP2011230670A

Publication Date:

May 13, 2013

Filing Date:

October 20, 2011

Export Citation:

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Assignee:

SUMITOMO ELECTRIC INDUSTRIES

International Classes:

H01L21/683; H01L21/3065; H01L21/31

Domestic Patent References:

JP2002313900A	2002-10-25
JP2003133233A	2003-05-09
JP2002260829A	2002-09-13
JP2002514010A	2002-05-14
JP2009054871A	2009-03-12
JP2004307939A	2004-11-04
JP2002313900A	2002-10-25
JP2003133233A	2003-05-09
JP2002260829A	2002-09-13
JP2002514010A	2002-05-14

Attorney, Agent or Firm:

辻川典範
山本正緒

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