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Title:
WAFER HOLDER FOR SEMICONDUCTOR MANUFACTURING APPARATUS
Document Type and Number:
Japanese Patent JP2013089850
Kind Code:
A
Abstract:

To provide a wafer holder which makes damage due to heat stress less likely to occur in a wafer holder and is excellent in heat uniformity.

A wafer holder for a semiconductor manufacturing apparatus is composed of: a substrate 1 having an embedded heating element 2 and formed by a material composed mainly of aluminum nitride; and a cylindrical support medium 4 mechanically coupling to the substrate 1 and supporting the substrate 1. In the wafer holder for the semiconductor manufacturing apparatus, a cylindrical body 12 housing a temperature measuring element 11 for measuring a temperature of the substrate 1 is provided in the support medium 4. The ambient atmosphere exists in the cylindrical body 12 and is isolated from the atmosphere in the support medium 4.


Inventors:
KIMURA KOICHI
SHIMAO DAISUKE
NATSUHARA MASUHIRO
MIKUMO AKIRA
NAKADA HIROHIKO
Application Number:
JP2011230670A
Publication Date:
May 13, 2013
Filing Date:
October 20, 2011
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01L21/683; H01L21/3065; H01L21/31
Domestic Patent References:
JP2002313900A2002-10-25
JP2003133233A2003-05-09
JP2002260829A2002-09-13
JP2002514010A2002-05-14
JP2009054871A2009-03-12
JP2004307939A2004-11-04
JP2002313900A2002-10-25
JP2003133233A2003-05-09
JP2002260829A2002-09-13
JP2002514010A2002-05-14
Attorney, Agent or Firm:
辻川 典範
山本 正緒