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Title:
WAFER SUPPORTING MEMBER
Document Type and Number:
Japanese Patent JP2007005816
Kind Code:
A
Abstract:

To provide a wafer supporting member which can be used over the long term even under an environment in which thermal cycling is added repeatedly, by preventing generation of a crack in the vicinity of a corner of a conductive film used as an internal electrode.

In a wafer supporting member 11 in which one principal surface of a plate-like ceramic body 12 is used as a mounted surface 13 in which a wafer W is mounted, and at least two conductive films 15a and 15b are buried to the identical depth in the plate-like ceramic body 12; at least one conductive film 15b has the corner, the shortest distance between the corner and the other conductive film 15a is made to 25 mm or less, and, at the same time, an angle of the corner is made to be a circular shape P.


Inventors:
YOSHIDA MASAO
Application Number:
JP2006000187833
Publication Date:
January 11, 2007
Filing Date:
July 07, 2006
Export Citation:
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Assignee:
KYOCERA CORP
International Classes:
H01L21/02; H01L21/683; H05B3/10; H05B3/18; H05B3/20; H05B3/74
Domestic Patent References:
JP2001223260A2001-08-17
JP2000228270A2000-08-15
JPH09186112A1997-07-15
JPH0982786A1997-03-28
JPH08274147A1996-10-18
JPH0992622A1997-04-04
JP2001223260A2001-08-17
JP2000228270A2000-08-15
JPH09186112A1997-07-15
JPH0982786A1997-03-28
JPH08274147A1996-10-18
JPH0992622A1997-04-04