Title:
WAFER TRANSFER MECHANISM AND WAFER PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2014204089
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To radiate ultraviolet ray to a protective tape while sucking well even with a minute chip after DBG.SOLUTION: A wafer transfer mechanism 1 transfers a wafer W in which a device region 23, in which a plurality of devices 24 are formed by being divided by a plurality of scheduled division lines, and an outer periphery margin region 22 which encloses the device region 23 are formed on a surface 21. It includes at least a transfer pad 10 which has a shape equivalent to a profile of the wafer W and abuts on a rear surface 26 of the wafer W for sucking and holding, and an arm 5 for moving the transfer pad 10. The transfer pad 10 includes a ring-like sucking/holding part 12 which sucks and holds the outer periphery margin region 22 of the wafer W, and a device region abutment part 13 which is enclosed with the sucking/holding part 12 and abuts on the device region 23 of the wafer W.
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Inventors:
NISHIDA DAISUKE
OHINO KOICHI
KOSHIMIZU HIDEKI
OHINO KOICHI
KOSHIMIZU HIDEKI
Application Number:
JP2013081637A
Publication Date:
October 27, 2014
Filing Date:
April 09, 2013
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/677; H01L21/301; H01L21/304
Domestic Patent References:
| JP2003133390A | 2003-05-09 | |||
| JPS6387831U | 1988-06-08 | |||
| JP2007258206A | 2007-10-04 | |||
| JP2012124468A | 2012-06-28 | |||
| JP2000068293A | 2000-03-03 | |||
| JPH05160102A | 1993-06-25 | |||
| JP2011023433A | 2011-02-03 | |||
| JP2010103286A | 2010-05-06 |
Attorney, Agent or Firm:
Hiroaki Sakai