Title:
WALLPAPER WITH ADHESIVE LAYER
Document Type and Number:
Japanese Patent JP2020169397
Kind Code:
A
Abstract:
To provide a wallpaper which is less likely to generate distortion and wrinkles due to drying shrinkage during construction, does not require energy for moisture drying, and can be easily aligned, temporarily fixed, removed and replaced.SOLUTION: A wallpaper is obtained by laminating a hot melt adhesive layer made of a hot melt resin on one side of a wallpaper substrate. The wallpaper has a 90-degree peeling force of 5 N/50 mm to 12 N/50 mm as measured according to JIS K 6854-1 after the hot melt adhesive layer of the wallpaper is brought into close contact with a gypsum board and heated at 100°C for 1 minute. When the storage elasticity at T1°C of the hot-melt resin is represented as G1 and the storage elasticity at T2°C of the hot-melt resin is represented as G2, there are a temperature T1°C and a temperature T2°C which satisfy G2/G1≥1000 and T2-T1≤40.SELECTED DRAWING: None
Inventors:
ASAYAMA YOSHIYUKI
TSUKADA TSUTOMU
NAKAMURA YOHEI
TSUKADA TSUTOMU
NAKAMURA YOHEI
Application Number:
JP2019069592A
Publication Date:
October 15, 2020
Filing Date:
April 01, 2019
Export Citation:
Assignee:
OJI HOLDINGS CORP
International Classes:
D06N7/00; B32B13/08; E04F13/07
Domestic Patent References:
| JPH107993A | 1998-01-13 | |||
| JPH0738199U | 1995-07-14 | |||
| JP2002088678A | 2002-03-27 | |||
| JPS5218205U | 1977-02-09 | |||
| JP2016069854A | 2016-05-09 |