WATER-BASE PHOTO SOLDERING RESIST COMPOSITION

Title:

WATER-BASE PHOTO SOLDERING RESIST COMPOSITION

Document Type and Number:

Japanese Patent JP2001222103

Kind Code:

A

Abstract:

To provide a water-base photo soldering resist composition having no problem on storage stability, excellent in heat resistance and emitting no solvent odor.

The water-base photo soldering resist composition contains (A) an aqueous solution obtained by neutralizing a resin containing a radical polymerizable group and a carboxyl group with a base, (B) an inorganic filler, (C) a photo-curable composition comprising a polyfunctional acrylic monomer (c1), a compound (c2) having a cyclic ether group other than a glycidyl group and a photopolymerization initiator (c3) and, optionally, (D) an aqueous solution obtained by neutralizing a radical polymer having 130-230 mgKOH/g acid value with a base. The cyclic ether group may be an alicyclic epoxy group or an oxetane group.

Inventors:

YABUUCHI NAOYA
FUJITA MINORU
NANBA OSAMU
OKAJIMA KEIICHI

Application Number:

JP2000168579A

Publication Date:

August 17, 2001

Filing Date:

June 06, 2000

Export Citation:

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Assignee:

NIPPON PAINT CO LTD

International Classes:

C08F2/44; C08F2/46; C08F290/00; C08F299/00; C08G59/20; C08G59/42; C08K3/30; C08K3/34; C08K5/3417; C08K5/3437; C08L55/00; C08L63/00; C08L101/14; G03F7/004; G03F7/028; G03F7/032; G03F7/033; G03F7/038; G03F7/027; H05K3/28; (IPC1-7): G03F7/027; C08F2/44; C08F2/46; C08F290/00; C08F299/00; C08G59/20; C08G59/42; C08K3/30; C08K3/34; C08K5/3417; C08K5/3437; C08L55/00; C08L63/00; C08L101/14; G03F7/004; G03F7/028; G03F7/033

Attorney, Agent or Firm:

Contents Makoto (1 person outside)

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