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Title:
WATER-BASED CUTTING FLUID FOR SILICON INGOT
Document Type and Number:
Japanese Patent JP2012087297
Kind Code:
A
Abstract:

To provide a water-based cutting fluid for silicon ingot, excellent in low foamability in a cutting process of silicon ingots, excellent in cleaning performance in a cleaning process of silicon wafers obtained by cutting, and further bringing an excellent flatness to the silicon wafer after cutting.

The water-based cutting fluid for silicon ingot contains as essential components, water and a polyoxyalkylene compound (A) having HLB of 6 to 20 represented by general formula (1) [wherein R is 1-8C alkyl; m is 1 to 10 of average addition number of moles of ethylene oxide; n is 0 to 5 of that of propylene oxide; m/(m+n) is 0.4 to 1.0; and the addition conditions of ethylene oxide and propylene oxide may be block or random]. The water content of the water-based cutting fluid when in use is 70-99.99 wt.% based on total of the cutting fluid.


Inventors:
ASAMI ARIHIRO
KATSUKAWA YOSHITAKA
KERA TAKURO
Application Number:
JP2011206997A
Publication Date:
May 10, 2012
Filing Date:
September 22, 2011
Export Citation:
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Assignee:
SANYO CHEMICAL IND LTD
International Classes:
C10M171/02; C10M105/18; C10M107/34; H01L21/304; C10N20/00; C10N30/00; C10N40/22
Domestic Patent References:
JPH04218594A1992-08-10
JPH1053789A1998-02-24
JPH10324889A1998-12-08
JP2011230275A2011-11-17