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Patent Searching and Data


Title:
WET MOLDING APPARATUS
Document Type and Number:
Japanese Patent JP2008240054
Kind Code:
A
Abstract:

To provide a wet molding apparatus capable of maintaining high the property to keep slurry filling amount constant, speediness and evenness.

The wet molding apparatus 1 is provided with a plurality of syringe parts 3, a syringe advancing mechanism 5, a tank part 7, a molding mold part 9, and a syringe elevating/lowering mechanism 11. The syringe parts are each movably installed along a circulation track to suck and eject slurry. The syringe advancing mechanism advances the plurality of syringe parts along the circulation track. The tank part is installed on the circulation track, and stores the slurry to be sucked into the syringe parts. The molding part is installed on the circulation track and receives the slurry ejected from the advancing syringe parts over a specified range of the circulation track. The syringe elevating/lowering mechanism elevates or lowers the plurality of syringe parts at least with respect to the tank part.


Inventors:
TODA KAZUSHIGE
ITO TAKESHI
Application Number:
JP2007081197A
Publication Date:
October 09, 2008
Filing Date:
March 27, 2007
Export Citation:
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Assignee:
TDK CORP
International Classes:
B22F3/03; B22F3/02; B28B3/02; B28B13/02; H01F41/02
Attorney, Agent or Firm:
Mijiro Abe
Yoshikazu Takei