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Patent Searching and Data


Title:
WIRE SAW, AND ITS USE
Document Type and Number:
Japanese Patent JPH11216657
Kind Code:
A
Abstract:

To firmly fix the abrasive grain by containing a filler of the prescribed grain size in a resin having the prescribed elasticity and softening temperature, and to form an abrasive cutting edge and a tip pocket from the beginning by the raise of the abrasive grain.

A core wire 1 is formed by a roving 2, and its outer circumferential surface is covered with a coating in which the abrasive grain 3 and a filler 4 are mixed in a solution where the resin is solved in the solvent by a resin bond 5 formed through baking and hardening. The grain size of the abrasive grain 3 is not less than 2/3 of the thickness of a resin bond layer, and not more than 1/2 of the diameter of a fiber body, and the resin bond 5 is formed of a resin of not less than 100 kg/mm3 in elasticity and not less than 200°C in softening temperature. The resin contains the filler 4 whose grain size is less than 2/3 of the thickness of the resin bond layer.


Inventors:
SUGAWARA JUN
KAMIOKA ISAO
MIZOGUCHI AKIRA
YAMANAKA MASAAKI
OGAWA HIDEKI
URAKAWA NOBUO
Application Number:
JP3370398A
Publication Date:
August 10, 1999
Filing Date:
January 30, 1998
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES
OSAKA DIAMOND IND
International Classes:
B24B27/06; B23D61/18; B24D3/28; B24D11/00; B28D5/04; (IPC1-7): B24B27/06; B24D3/28; B24D11/00; B28D5/04
Attorney, Agent or Firm:
Hidemi Aoki (1 outside)