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Patent Searching and Data


Title:
WIRE USED IN MULTIWIRE SAW
Document Type and Number:
Japanese Patent JP11010514
Kind Code:
A
Abstract:

To improve the slurry holding force so as to shorten the slice time by forming a wire for cutting an object material while slurry is supplied in the shape of being spirally twisted.

A wire 8a uses a brass-plated (Zn,Cu) piano wire represented by JIS-G-SWRS82A. This one wire is worked to be spirally twisted. Working is thus performed to form a spirally recessed part on the surface. In the case of using the wire 8a to cut a silicon block with a multiwire saw, slurry is held in the recessed part of the wire surface. Accordingly, as compared with the conventional wire, the slurry holding force can be improved so as to increase the slurry supply amount per cutting unit hour. Thus, the table lowering speed can be increased so as to shorten the cutting time, so that the production efficiency can be improved and the production cost can be decreased.


Inventors:
Kamitaka, Masuo
Application Number:
JP1997000169204
Publication Date:
January 19, 1999
Filing Date:
June 25, 1997
Export Citation:
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Assignee:
SHARP CORP
International Classes:
B24B27/06; B23D61/18; B24B27/06; B23D61/00; (IPC1-7): B24B27/06