To provide a wiring board with a component incorporated therein which can be manufactured at low cost while maintaining soundness as a wiring board and electrical reliability in incorporating the component.

A wiring board with a component incorporated therein comprises a first insulating layer, a second insulating layer which is positioned while being laminated thereon, an electric/electronic component buried in the second insulating layer and including two or more terminals, and a plurality of lands for mounting the electric/electronic component. A plane figure comprised of substantial planar spreading of the plurality of lands is a 180° point-symmetric graphic. The wiring board further comprises a wiring pattern which is provided while being held between and in contact with the first and second insulating layers, and formed from copper up to a top layer, a solder which electrically and mechanically connects the plurality of lands and the terminals of the electric/electronic component, and a resin pattern which is provided on the wiring pattern to partition a first region which is located on the lands and with which the solder is contacted, and a second region which is located on the wiring pattern extending from the first region and with which the solder is not contacted.