WIRING SUBSTRATE, ITS MANUFACTURE ELECTRONIC PART-MOUNTING WIRING SUBSTRATE AND ITS MANUFACTURE

Japanese Patent JP3694378

B2

PROBLEM TO BE SOLVED: To mass produce product, on which an electronic component is adhesively mounted on the gold layer of a connection terminal in normal conductive state, with a high yield rate.
SOLUTION: A package main body 1, provided with a gold layer 5 and a nickel layer 4 which is the lower layer of the gold layer 5 and mainly composed of nickel, is prepared, and a crystal piece 7 is mounted on the gold layer 5 of the package main body 1 through a conductive bonding agent 6, containing silver powder and silicon resin. Heat treatment is conducted under a state at the temperature increasing rate of 5°C/mm or higher, for example, to 150°C or higher maintained for one hour. As a result, the nickel in the nickel layer 4 diffuses to the surface of the gold layer 5, and at the same time, the heat curing of the conductive bonding agent can be accelerated by the diffused nickel. As a result, the gold layer 5 and the silver powder can be hardened almost uniformly, without the generation of a difference in hardening speed in the vicinity of the surface of the gold layer and the silver powder. Consequently, the surface of the gold layer 5 and the silver powder are hardened in the proximate state, and the crystal piece 7 is fixedly mounted on the package main body 1 in a conductive state.

Nakata Michitoshi
Tatsuya Uemura

JP33210896A

September 14, 2005

December 12, 1996

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Nippon Special Ceramics Co., Ltd.

H05K1/09; C23C18/52; H03H3/007; H03H3/02; H03H9/10; H05K3/32; H05K3/24; (IPC1-7): H05K3/32; C23C18/52; H05K1/09

JP7263493A
JP6283622A
JP8124424A
JP57040572A
JP7254773A

Tsutomu Adachi

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