Title:
基体保護膜及び付着防止部材
Document Type and Number:
Japanese Patent JP6441973
Kind Code:
B2
Abstract:
[Problem] To provide a substrate protection film which can reduce the adhesion of a substance onto the surface of a substrate more effectively than a substance adhesion reduction effect achieved by an electrostatic repulsion force. [Solution] A first layer (a charge retention layer 3) containing a charged substance and having an electrostatic repulsion force is formed on the surface of a substrate 1, and then a second layer (a functional group layer 4 that comprises a functional group having a functional group length of less than 1 nm and having a surface free energy of as low as 50 mJ/m2 or less) for controlling a surface free energy is formed on the surface of the first layer. When the substrate protection film 2 is formed in this manner, it becomes possible to reduce the adhesion of a substance which is caused by an intermolecular force while retaining the electrostatic repulsion force on the surface of the substrate 1, and therefore it becomes possible to reduce the adhesion of a substance onto the surface of the substrate 1 more effectively than a substance adhesion reduction effect achieved by an electrostatic repulsion force.
Inventors:
Shiro Ogata
Shuhei Suda
Shota Takamiya
Shuhei Suda
Shota Takamiya
Application Number:
JP2017010123A
Publication Date:
December 19, 2018
Filing Date:
January 24, 2017
Export Citation:
Assignee:
Seiwa Electric Co., Ltd.
International Classes:
C03C17/38; B08B17/02; B32B7/02; B32B9/00
Domestic Patent References:
| JP2009212435A | ||||
| JP9039149A | ||||
| JP2011526656A |
Foreign References:
| WO2008013148A1 | ||||
| US5352485 | ||||
| US20130323464 |
Attorney, Agent or Firm:
Patent Business Corporation Ark Patent Office