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Patent Searching and Data


Title:
PACKAGE FOR STORING ELECTRONIC PART
Document Type and Number:
Japanese Patent JPH0645468
Kind Code:
A
Abstract:

PURPOSE: To provide a package for storing an electronic part so as to be able to protect soldering material such as solder for sealing an insulating base body and lid body effectively from falling and protruding to form a protrusion on the outer surface of the sealed insulating base and lid bodies and further the protrusion thoroughly from faling on an external electric circuit substrate to cause its shortcircuit.

CONSTITUTION: This entitled package for storing electronic part consists of a rectangular insulating base body 1 in which a rectangular ring metal layer 8 is made to adhere to the peripheral section of the upper surface thereof and a rectangular lid body 2 in which a rectangular ring metal layer 9 is made to adhere to the peripheral section of the lower surface thereof, wherein the metal layer 8 of the insulating base body 1 and the metal layer 9 of the lid body 2 are sealed together using sealer 10 made of soldering material to hermetically store an electronic part 3 inside, and wherein the line widths of the corner sections of the rectangular ring metal layer 8 (9) which has been made to adhere to at least either one of the insulating base body 1 and lid body 2 are made to 50.0% to 95.0% of those of the straight line sections of the rectangular ring metal layer 8.


Inventors:
NISHI KOJI
YOSHIDA SADAKATSU
MIYAWAKI KIYOSHIGE
Application Number:
JP19361792A
Publication Date:
February 18, 1994
Filing Date:
July 21, 1992
Export Citation:
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Assignee:
KYOCERA CORP
International Classes:
H01L23/02; (IPC1-7): H01L23/02