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Title:
A conductive particle and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP5910503
Kind Code:
B2
Abstract:
Conductive particles containing at least a carbon-based conductive material and a binder resin, and having an average particle size of 50 μm or less, in which a pressure for causing deformation by 40% of a particle size of the conductive particles at 25° C. is 12 MPa or less, or a mass ratio of the binder resin relative to the carbon-based conductive material is 1/99 to 70/30.

Inventors:
田代 了嗣
上島 浩一
Application Number:
JP2012541882A
Publication Date:
April 27, 2016
Filing Date:
November 01, 2011
Export Citation:
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Assignee:
日立化成株式会社
International Classes:
H01B5/00; H01B1/00; H01B1/24; H01B13/00; H01R11/01
Domestic Patent References:
JP2009140865A2009-06-25
JP2001357735A2001-12-26
JP2002033022A2002-01-31
JPH08167320A1996-06-25
JP2009140865A2009-06-25
JP2001357735A2001-12-26
JP2002033022A2002-01-31
JPH08167320A1996-06-25
Attorney, Agent or Firm:
長谷川 芳樹
清水 義憲
酒巻 順一郎