Title:
可変非点焦点ビームスポットを用いたカッティング装置及びその方法
Document Type and Number:
Japanese Patent JP5518755
Kind Code:
B2
Abstract:
A variable astigmatic focal beam spot is formed using lasers with an anamorphic beam delivery system. The variable astigmatic focal beam spot can be used for cutting applications, for example, to scribe semiconductor wafers such as light emitting diode (LED) wafers. The exemplary anamorphic beam delivery system comprises a series of optical components, which deliberately introduce astigmatism to produce focal points separated into two principal meridians, i.e. vertical and horizontal. The astigmatic focal points result in an asymmetric, yet sharply focused, beam spot that consists of sharpened leading and trailing edges. Adjusting the astigmatic focal points changes the aspect ratio of the compressed focal beam spot, allowing adjustment of energy density at the target without affecting laser output power. Scribing wafers with properly optimized energy and power density increases scribing speeds while minimizing excessive heating and collateral material damage.
Inventors:
Patrick J. Sircel
Jeffrey P. Sercell
John Cook Park
Jeffrey P. Sercell
John Cook Park
Application Number:
JP2011005549A
Publication Date:
June 11, 2014
Filing Date:
January 14, 2011
Export Citation:
Assignee:
IPJ Micro Systems LLC
International Classes:
B23K26/364; B23K26/00; B23K26/06; B23K26/064; B23K26/067; B23K26/073; B23K26/36; B23K26/40; B28D5/00; G02B3/00; G02B9/00; G02B13/08; G03F7/20; H01L21/301
Domestic Patent References:
| JP2003017790A | ||||
| JP2002033495A | ||||
| JP2000343254A | ||||
| JP10305420A |
Attorney, Agent or Firm:
Yasuhiko Murayama
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro