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Title:
A device for depositing material on a substrate
Document Type and Number:
Japanese Patent JP6355772
Kind Code:
B2
Abstract:
Methods and apparatus for deposition of materials on a substrate are provided herein. In some embodiments, an apparatus for processing a substrate may include a process chamber having a substrate support disposed therein to support a processing surface of a substrate, an injector disposed to a first side of the substrate support and having a first flow path to provide a first process gas and a second flow path to provide a second process gas independent of the first process gas, wherein the injector is positioned to provide the first and second process gases across the processing surface of the substrate, a showerhead disposed above the substrate support to provide the first process gas to the processing surface of the substrate, and an exhaust port disposed to a second side of the substrate support, opposite the injector, to exhaust the first and second process gases from the process chamber.

Inventors:
Sanchez, Errol Antonio Cie.
Collins, Richard O.
Carlson, David K.
Bautista, Kevin
Dinnis, Herman Pee.
Patrei, Kailash
Mio, Nio.
Demas, Dennis El.
Marcadal, Christoph
Steve Jumper
Kuplao, Satish
Application Number:
JP2017015145A
Publication Date:
July 11, 2018
Filing Date:
January 31, 2017
Export Citation:
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Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H01L21/205; C23C16/455
Domestic Patent References:
JP7193015A
JP7153707A
JP2008227487A
JP7029827A
JP8139034A
JP2007049078A
JP2004200603A
JP2000349027A
JP2003317948A
JP7286274A
JP2001102372A
JP2002151489A
Foreign References:
WO2011043961A2
WO2010033659A1
WO2009120729A1
Attorney, Agent or Firm:
Sonoda/Kobayashi Patent Business Corporation