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Title:
Dielectric compositions for aluminum substrates, electronic devices, and methods for producing them.
Document Type and Number:
Japanese Patent JP6345239
Kind Code:
B2
Abstract:
High thermal conductivity dielectric materials systems or pastes are useful on aluminum alloy substrates for LED and high power circuitry applications.

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Inventors:
KIM,Steve,S.
Brown, Orville, W.
Gladi, George, Yi.
Application Number:
JP2016526769A
Publication Date:
June 20, 2018
Filing Date:
October 06, 2014
Export Citation:
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Assignee:
KIM,Steve,S.
International Classes:
H01B3/12; H01L33/62; H05K1/02; H05K1/05; H05K1/18; H05K3/44
Domestic Patent References:
JP2010195960A
JP59046703A
JP7272537A
JP2003192430A
JP2006290719A
JP2010531287A
JP2014534145A
Foreign References:
CN101740160A
Attorney, Agent or Firm:
Yuji Iwahashi



 
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