PURPOSE: To make it possible to easily realize a highly reliable aluminium bonding by a method wherein before a soldering process for soldering an element, electrodes for bonding on a thick film conductor are covered with a covering member and after the soldering process, the covering member is removed before a bonding process.

CONSTITUTION: A process for soldering an element 4, which is mounted on a circuit board 2, is provided and a process for aluminium-bonding external terminals of the board 2 to a thick film conductor 1 on the board 2 is provided to manufacture the circuit board 2. In this case, before the soldering process for soldering the element 4, a covercing process for covering electrodes for bonding on the conductor 1 with a covering member 7 is provided and after the soldering process, a removal process for removing the member 7 is provided before a bonding process. The member 7, for example, is formed of a resin, which is dissolved in a cleaning liquid for a solder paste material or a flux material. When dirt of a flux or the like is cleaned with the cleaning liquid after the element 4 is soldered, the covered resin 7 is also dissolved simultaneously in the cleaning liquid and the electrode parts for bonding are cleansed.