Title:
METHOD FOR PLATING CERAMICS PACKAGE
Document Type and Number:
Japanese Patent JPH054213
Kind Code:
A
Abstract:
PURPOSE: To reduce the production of an inferior product, in the plating of ceramics package, by easily and efficiently forming a plating layer to the surface of the ceramics package wherein the formation of an outgoing line for electroplating from a planning aspect.
CONSTITUTION: In the plating of a ceramics package 1a applying electroplating to a large number of the execution parts to be plated of the electrode pads 2 or connection pins 6 formed to the surface part of the ceramics packages 1a, a continuity jig 8 forming an electrical continuity state between the mutual execution parts to be plated is mounted on the package 1a to apply electroplating to the respective execution parts to be plated at the same time.
Inventors:
KIKUCHI NORIMI
MONMA JUN
KAWAMURA HIROYUKI
NAGAI HIROAKI
MONMA JUN
KAWAMURA HIROYUKI
NAGAI HIROAKI
Application Number:
JP15712091A
Publication Date:
January 14, 1993
Filing Date:
June 27, 1991
Export Citation:
Assignee:
TOSHIBA CORP
TOSHIBA MATERIAL ENG KK
TOSHIBA MATERIAL ENG KK
International Classes:
B28B11/04; H01L21/50; (IPC1-7): B28B11/04; H01L21/50
Attorney, Agent or Firm:
Hisano Hatano (1 person outside)
Next Patent: JPS54214