Title:
電子部品の装着方法
Document Type and Number:
Japanese Patent JP2529213
Kind Code:
B2
Inventors:
一天満谷 英二
村上 修一
森 和弘
村上 修一
森 和弘
Application Number:
JP17802686A
Publication Date:
August 28, 1996
Filing Date:
July 29, 1986
Export Citation:
Assignee:
松下電器産業株式会社
International Classes:
H01L21/301; B23P21/00; B28D5/00; H01L21/67; H01L21/68; H01L21/78; H05K3/30; H05K13/00; H05K13/02; H05K13/04; (IPC1-7): H05K13/04; B23P21/00
Attorney, Agent or Firm:
滝本 智之