Title:
電気的相互接続構造体及びその形成方法
Document Type and Number:
Japanese Patent JP2010525558
Kind Code:
A
Abstract:
An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.
Inventors:
Bookwalter, Stefan, Leslie
Furman, Bruce, Kenneth
Gruber, Peter, Alfred
Na, jeune
Sea, Dayuan
Furman, Bruce, Kenneth
Gruber, Peter, Alfred
Na, jeune
Sea, Dayuan
Application Number:
JP2010502479A
Publication Date:
July 22, 2010
Filing Date:
March 26, 2008
Export Citation:
Assignee:
INTERNATIONAL BUSINESS MASCHINES CORPORATION
International Classes:
H01L21/60; H01L23/32; H05K1/14; H05K3/34; H05K3/36
Domestic Patent References:
| JPH11330126A | 1999-11-30 | |||
| JP2004356138A | 2004-12-16 | |||
| JP2003258029A | 2003-09-12 |
Attorney, Agent or Firm:
Takeshi Ueno
Tasaichi Tanae
Yoshihiro City
Tasaichi Tanae
Yoshihiro City