Title:
ガスを保持するための静電シールを使用してウエハをクランプする装置および方法
Document Type and Number:
Japanese Patent JP4557200
Kind Code:
B2
Abstract:
Methods and apparatus are provided for holding a workpiece, such as a semiconductor wafer, during processing. The apparatus includes a platen assembly, a gas source and voltage source. The platen assembly includes a dielectric element that defines an electrically insulating clamping surface for receiving a workpiece and electrodes underlying the clamping surface. The electrodes include sealing electrodes at or near a periphery of the clamping surface. The gas source provides a gas in a region between the workpiece and the clamping surface for conducting thermal energy between the workpiece and the clamping surface. The voltage source applies sealing voltages to the sealing electrodes for producing an inwardly moving wave in the workpiece. Gas is transported inwardly away from the periphery of the clamping surface by the inwardly moving wave. The sealing electrodes may have the form of concentric rings at or near the periphery of the clamping surface.
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Inventors:
Larsen, Grant Kenji
Application Number:
JP2001535225A
Publication Date:
October 06, 2010
Filing Date:
November 01, 2000
Export Citation:
Assignee:
Varian Semiconductor Equipment Associates, Inc.
International Classes:
F16J15/04; H01L21/683; F16J15/40
Domestic Patent References:
| JP7506465A | ||||
| JP729968A | ||||
| JP1251735A | ||||
| JP10150100A | ||||
| JP9191005A |
Foreign References:
| WO1998057371A1 |
Attorney, Agent or Firm:
Akira Hori