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Title:
【発明の名称】傷を切断する装置及び方法
Document Type and Number:
Japanese Patent JP2001522684
Kind Code:
A
Abstract:
A system for severing lesions within a living body includes a housing defining an interior tissue receiving chamber is coupled to the distal end of an endoscope. At least one snare extends around the ligating band supporting surface so that, when at least one ligating band is received around the ligating band supporting surface, drawing the at least one snare off the ligating band supporting surface releases a corresponding ligating band from the ligating band supporting surface. In addition, a method for severing tissue comprises the steps of introducing into the body an endoscope to which a housing defining an interior tissue receiving chamber is coupled, wherein at least one snare and at least one ligating band extend around the ligating band supporting surface and advancing the distal end of the endoscope into the body until the housing is located adjacent to a first portion of tissue to be severed. The first portion of tissue is then drawn into the interior chamber and a snare is drawn off the distal end of the housing to release a corresponding ligating band from the ligating band supporting surface so that the ligating band and the snare encircle the first portion of tissue.

Inventors:
Ju, Michael S. H.
Chin, Yemu
Application Number:
JP2000520693A
Publication Date:
November 20, 2001
Filing Date:
November 06, 1998
Export Citation:
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Assignee:
Boston Scientific Limited
International Classes:
A61B17/12; A61B17/32; A61B17/3211; A61B18/14; (IPC1-7): A61B17/12; A61B17/32; A61B18/14
Attorney, Agent or Firm:
Takashi Ishida (3 others)



 
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