PURPOSE: To make it possible to test the presence or absence of the formation of a bump accurately and readily at the same time as an intrinsic test by blocking the contact of a needle and an electrode formed on an IC with a supporting part for the needle for a prober.

CONSTITUTION: A supporting part 7 is provided at a needle 6 so that the needle 6 does not come into contact with an electrode 2 when a bump 4 is not formed and the needle 6 is moved into the downward direction. The needle is moved downward for performing die-sort test. When the bump 4 is formed on the electrode 2 at this time, the tip of the needle comes into contact with the upper side of the bump 4, and the tip of the supporting part 7 does not come into contact into a surface protecting layer 3 of an IC 1. Meanwhile, when the bump 4 is not formed on the electrode 2, the needle 6 and the supporting part 7 are further moved downward, the tip of the supporting part 7 comes into contact with the protecting layer 3 and the needle 6 does not come into contact with the electrode 3. Therefore, the presence or absence of the formation of the bump 4 can be readily judged.