Title:
厚膜用ホトレジスト組成物及びレジストパターンの形成方法
Document Type and Number:
Japanese Patent JP4384570
Kind Code:
B2
Abstract:
A negative thick film photoresist composition with improved alkali developability is provided. The composition comprises: (A) a resin component containing (a) from 61 to 90% by weight of a structural unit derived from a cyclic alkyl (meth)acrylate ester, and (b) a structural unit derived from a radical polymerizable compound containing a hydroxyl group, (B) a polymerizable compound containing at least one ethylenic unsaturated double bond, (C) a photopolymerization initiator, and (D) an organic solvent.
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Inventors:
Yasushi Washio
Koji Saito
Koji Saito
Application Number:
JP2004265693A
Publication Date:
December 16, 2009
Filing Date:
September 13, 2004
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
G03F7/033; G03F7/40
Domestic Patent References:
| JP8078318A | ||||
| JP8029979A | ||||
| JP2097516A | ||||
| JP8301911A | ||||
| JP2000039709A |
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Masakazu Aoyama
Suzuki Mitsuyoshi
Noriko Yanai
Masatake Shiga
Masakazu Aoyama
Suzuki Mitsuyoshi
Noriko Yanai