Title:
The guide element in the nipper unit of combing machinery
Document Type and Number:
Japanese Patent JP6016901
Kind Code:
B2
Inventors:
Daniel bomber
David Perez
David Perez
Application Number:
JP2014513872A
Publication Date:
October 26, 2016
Filing Date:
May 25, 2012
Export Citation:
Assignee:
Maschinenfabrik Rieter AG
International Classes:
D01G19/16
Domestic Patent References:
JP2004250857A | ||||
JP2005068634A |
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Takuya Kuno
Takuya Kuno
Previous Patent: The shuttle plate which has a pocket for corresponding to a plurality of semiconductor package sizes
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