Title:
電子部品実装基板の放熱設計方法およびプログラム
Document Type and Number:
Japanese Patent JP6539862
Kind Code:
B2
Inventors:
Mizuta Kei
Kenji Fukuda
Kenji Fukuda
Application Number:
JP2015118280A
Publication Date:
July 10, 2019
Filing Date:
June 11, 2015
Export Citation:
Assignee:
National University Corporation Kagoshima University
Shikoku Measurement Industry Co., Ltd.
Shikoku Measurement Industry Co., Ltd.
International Classes:
H01L23/36; H01L23/12; H01L33/64
Domestic Patent References:
| JP10222492A | ||||
| JP2006291725A |
Attorney, Agent or Firm:
Akinobu Sudo
Asako Sudo
Asako Sudo